In industries such as precision manufacturing, optics, semiconductors, and aerospace, surface roughness is a crucial metric for evaluating the quality of a component’s surface. Surface roughness affects not only the appearance of a product but also its friction, optical reflectiv...

AbstractDiamond films are thin film materials with excellent physicochemical properties, demonstrating significant advantages in hardness, thermal conductivity, and transparency. As a result, they find extensive applications in high-tech fields such as electronics, optics, and me...

Silicon carbide (SiC), as a third-generation semiconductor material, plays a crucial role in modern high-tech applications due to its wide bandgap, high thermal conductivity, excellent chemical stability, and radiation resistance. Particularly, 2-inch, 3-millimeter thick silicon ...

As modern electronic devices evolve towards miniaturization, thinness, and high performance, integrated circuit (IC) manufacturing processes are continuously optimized to meet increasingly stringent technical demands. Wafer thinning, a critical step in the back-end processing of ...

Recently, a renowned international client conducted a thorough evaluation of JXT's 4H Silicon Carbide (SiC) wafers and provided detailed technical feedback. The client assessed key aspects such as transmission, reflection, and overall crystalline quality, verifying the superi...

Silicon carbide (SiC) is a crucial wide-bandgap semiconductor material widely used in high-power electronics and optical devices. Depending on the application requirements, SiC wafers are typically categorized into conductive and semi-insulating types. Conductive SiC wafers are d...

Gallium nitride (GaN), as a crucial wide-bandgap semiconductor material, is renowned for its exceptional electrical, thermal, and optical properties. It has found widespread use in high-power, high-frequency electronic devices, as well as optoelectronic devices. GaN epitaxy techn...

Silicon carbide (SiC) is an advanced functional material that, due to its outstanding physical and chemical properties, is widely used in various industrial fields. Silicon carbide ceramics and silicon carbide wafers are two typical forms of SiC products. While both are based on ...

Wafer dicing is a critical step in semiconductor manufacturing, involving the process of cutting a semiconductor wafer into individual chips (dies) after circuit fabrication is completed. This step typically follows wafer processing and testing, serving as a key operation before ...

In the production of silicon carbide (SiC) wafers, monitoring and testing of process parameters are crucial to ensuring the quality and performance of the wafers. Below are some relevant terms and their explanations:1. Terms Related to Wafer ManufacturingEpitaxial Layer: A high-q...