Chemical Mechanical Planarization (CMP) is a critical process in semiconductor manufacturing, combining mechanical abrasion and chemical corrosion to achieve material planarization. However, due to its complexity, various defects can arise during the CMP process. These defects ca...

In the semiconductor industry, yield is a core metric for evaluating production efficiency and cost-effectiveness in wafer manufacturing. Yield directly impacts manufacturing costs and determines a company’s competitive edge. Managing and improving yield is a complex, ongoing pro...

In the semiconductor industry, particularly in the field of third-generation semiconductors (wide-bandgap semiconductors), the roles of the substrate and epitaxial layer are crucial. The substrate serves as the foundation for semiconductor devices, while the epitaxial layer enhan...

In silicon carbide (SiC) wafer manufacturing, orientation flats (flat edges) and notches are two common methods used to indicate the wafer’s crystal orientation and axes, aiding precise alignment during the manufacturing and handling processes. The choice between these two markin...

Gallium Arsenide (GaAs) wafers, as a crucial compound semiconductor material, are widely used in the production of high-performance electronic and optoelectronic devices due to their exceptional electronic and optical properties. To meet the diverse demands of various application...

With the continuous advancement of modern semiconductor technology, integrated circuits (ICs) are rapidly evolving toward higher density, miniaturization, and lower power consumption. Against this backdrop, wafer thinning technology has become increasingly crucial. Wafer thinning...

Gallium Nitride (GaN), as a core material of the third-generation wide bandgap semiconductors, is rapidly emerging as the ideal choice for optoelectronic, power electronic, and microelectronic applications due to its superior properties. GaN exhibits high breakdown field strength...

As technology rapidly advances, the performance demands on electronic materials continue to escalate, and traditional silicon-based materials are gradually falling short of meeting the needs of emerging applications. Against this backdrop, gallium oxide (Ga₂O₃) has garnered signi...

IntroductionSilicon carbide (SiC), as a wide-bandgap semiconductor material, is widely used in high-power, high-frequency, and high-temperature electronic devices due to its excellent physical and chemical properties, such as high breakdown electric field, high thermal conductivi...

Gallium Arsenide (GaAs), with the chemical formula GaAs, is a black-gray solid with a melting point of 1238°C. It remains stable in air at temperatures below 600°C and is resistant to corrosion by non-oxidizing acids.Gallium arsenide is a crucial semiconductor material classified...