Language
EnglishEnglish
FrenchFrench
GermanGerman
JapaneseJapanese

Follow us

facebook linkdin twitter whatsapp

About Us

About Us

Blogs

4-Inch Gallium Oxide (Ga₂O₃) Single Crystals: Growth Techniques and Future Applications

published on 03 Apr 2025

As third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) continue to gain traction in high-power electronic applications, researchers are actively exploring the next generation of wide-bandgap semiconductors. Among these, gallium oxide (Ga₂O₃) has emerged as a promising candidate due to its ultra-wide bandgap (4.8–5.3 eV) and exceptionally high breakdown electric field (>8 MV/cm). The successful fabrication of 4-inch and larger Ga₂O₃ single crystals has further accelerated its industrial development.


This article discusses the growth methods of 4-inch Ga₂O₃ single crystals, key material properties, application prospects, and current challenges in commercialization.


1. Why Is Gallium Oxide (Ga₂O₃) Gaining Attention?


Gallium oxide (Ga₂O₃) is an emerging ultra-wide bandgap semiconductor that surpasses conventional silicon (Si) and third-generation semiconductors (SiC and GaN) in terms of bandgap energy and breakdown electric field.


Material Bandgap (eV)

Breakdown Electric Field

 (MV/cm)

Electron Mobility

 (cm²/V·s)

Si1.10.31400
GaAs1.40.48500
SiC3.33.0900
GaN3.43.32000
Ga₂O₃ 4.8 – 5.3>8.0150 – 300


As shown in the table, Ga₂O₃ exhibits a significantly higher breakdown electric field than SiC and GaN, making it particularly advantageous for high-power and high-voltage device applications.


Moreover, unlike SiC and GaN, which require expensive epitaxial growth techniques due to their high melting points, Ga₂O₃ can be grown via melt-based methods, reducing production costs and facilitating large-scale manufacturing.


2. Growth Techniques for 4-Inch Ga₂O₃ Single Crystals


The successful commercialization of Ga₂O₃ relies heavily on the ability to fabricate high-quality, large-diameter single crystals. The main growth techniques include:


(1) Vertical Bridgman (VB) Method

This method involves melting Ga₂O₃ source material in a crucible and gradually cooling it to promote crystallization. It enables the growth of large-diameter, low-defect Ga₂O₃ crystals and is well-suited for mass production.


(2) Floating Zone (FZ) Method

The FZ method utilizes induction heating to melt the source material without a crucible, followed by controlled crystallization. This technique produces high-purity, low-defect Ga₂O₃, but its scalability for large-diameter wafers is limited due to gravitational constraints.


(3) Edge-Defined Film-Fed Growth (EFG) Method

EFG leverages capillary action to draw molten Ga₂O₃ upward through a die, where it crystallizes into a large-area wafer. This technique enables the direct fabrication of thin, large-diameter Ga₂O₃ substrates, making it suitable for 4-inch and larger wafer production.


(4) Physical Vapor Transport (PVT) Method

PVT involves sublimating Ga₂O₃ source material at high temperatures and allowing it to condense and crystallize in a lower-temperature region. While this method produces high-quality β-Ga₂O₃ single crystals, its relatively slow growth rate poses challenges for large-scale wafer production.


3. Key Properties of 4-Inch Ga₂O₃ Single Crystals


The performance of 4-inch Ga₂O₃ wafers is crucial for their application in high-power electronic devices. The following table summarizes key material properties:


PropertyTypical Value
Crystal Structureβ-Ga₂O₃ (Monoclinic)
Bandgap4.8 – 5.3 eV
Breakdown Field> 8 MV/cm
Electron Mobility150 – 300 cm²/V·s
Doping TypeIntrinsic, n-type (Sn, Si-doped)
Resistivity0.01 – 10 Ω·cm (Doping-dependent)
Crystal Orientations(100), (010), (001)
Dielectric Constant10 – 15
Thermal Conductivity10 – 27 W/m·K


Ga₂O₃ can be effectively n-type doped using Sn or Si, allowing for tunable electrical conductivity. However, achieving stable p-type doping remains a major challenge, limiting the development of complementary metal-oxide-semiconductor (CMOS) circuits.


4. Applications of 4-Inch Ga₂O₃ Single Crystals


Thanks to its unique material properties, Ga₂O₃ demonstrates enormous potential in the following fields:


(1) High-Power Electronic Devices

Ga₂O₃’s high breakdown field makes it ideal for power switching devices, such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and Schottky barrier diodes (SBDs). Compared to SiC and GaN, Ga₂O₃ enables higher power densities with smaller device footprints.


(2) Deep-Ultraviolet (DUV) Photodetectors

With its ultra-wide bandgap, Ga₂O₃ is highly transparent in the ultraviolet range, making it suitable for solar-blind DUV photodetectors (250–280 nm). These devices are essential in fire detection, environmental monitoring, and biological sensing.


(3) Radio Frequency (RF) and Microwave Devices

Ga₂O₃ is promising for high-frequency applications, such as 5G communication and millimeter-wave radar, where it can be used in power amplifiers and low-loss RF switches.


(4) Transparent Electronics

The optical transparency of Ga₂O₃ makes it an excellent candidate for transparent conductive films, optoelectronic devices, and integrated optical circuits.


5. Challenges and Future Development Trends


Despite its promising potential, Ga₂O₃ faces several challenges that must be addressed before widespread commercialization:


  • p-Type Doping Limitations: Achieving stable and efficient p-type doping remains a significant obstacle, limiting Ga₂O₃’s applicability in CMOS-compatible circuits.


  • Uniformity Control for Large-Diameter Wafers: Maintaining crystal quality and uniform electrical properties across 6-inch and larger Ga₂O₃ wafers is critical for industrial-scale adoption.


  • Thermal Management Issues: Ga₂O₃ has relatively low thermal conductivity (10–27 W/m·K), necessitating advanced heat dissipation strategies, such as integration with high-thermal-conductivity materials like SiC or diamond.


6. Conclusion


The successful growth and application of 4-inch Ga₂O₃ single crystals are driving significant advancements in next-generation power electronics. With ongoing improvements in crystal growth techniques and device fabrication processes, Ga₂O₃ is poised to play a transformative role in high-voltage power electronics, wireless communications, and deep-ultraviolet detection. As the semiconductor industry continues to innovate, Ga₂O₃ could become a key material for future high-performance electronic and optoelectronic devices.


Share
2022 © SiC Wafers and GaN Wafers Manufacturer     Powered By Bontop