Polycrystalline diamond substrate

Specific Information

Polycrystalline diamond wafers feature exceptional hardness, high thermal conductivity, and chemical stability, making them ideal for demanding industrial applications. They are commonly used in high-power electronics, precision cutting tools, and heat spreaders due to their durability and performance under extreme conditions.

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specification
Properties

Item	Polycrystalline diamond substrate
Diameter	10*10mm	20*20mm	25.4±0.3mm	50.8±0.5mm
Thickness	300~500μm
Growth Method	MPCVD
Surface Finish	Grind,SSP,DSP
Polish roughness(AFM,5*5μm)	1~10nm
Thermal conductivity	1000-2000W/m.K

Sample testing data

● AFM surface roughness of single-crystal diamond

● TTV, WARP, BOW, and surface roughness of polycrystalline diamond

Customization specifications：

* Various sizes and shapes such as 5*5mm,10*10mm,1~4inch.
* Various thicknesses:0.1~5mm
* Various surface roughness such as slicing,lapping.
* crystal type:single crystal diamond or polycrystalline diamond.

Diamond is an extremely hard material with a cubic crystal structure, featuring a high Mohs hardness (10), high melting point (4027 °C), and excellent thermal conductivity (20 W·cm⁻¹·°C⁻¹). It also has a wide band gap (5.47 eV), high breakdown electric field (10 MV·cm⁻¹), and good electron mobility (1600 cm²·V⁻¹·s⁻¹), making it ideal for high-power and high-frequency electronic applications.

Property

Value

Crystal Structure

Cubic Crystal

Band Gap (eV)

5.47 eV

Melting Point (℃)

4027 ℃

Mohs Hardness

Thermal Conductivity (W·cm⁻¹·℃⁻¹)

Thermal Expansion Coefficient (℃⁻¹)

0.8 × 10⁻⁶

Lattice Constant (nm)

0.3567 nm

Electron Mobility (cm²·V⁻¹·s⁻¹)

1600

Breakdown Electric Field (MV·cm⁻¹)

JFM Index (Power)

5330

BFM Index (SW)

14860

BHFM Index (RF)

1080

Refractive Index

2.417

Polycrystalline diamond substrate

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