Language
EnglishEnglish
FrenchFrench
GermanGerman
JapaneseJapanese

Follow us

facebook linkdin twitter whatsapp
Share

CVD Diamond Substrate

Specific Information
Diamond can be widely used in some fields such as ultra-precision machining, luxury jewelry, optics, quantum materials, electronic materials and semiconductor devices due to its large bandgap, highest thermal conductivity, low thermal expansion, incredible electrical resistivity, widest optical transparency and other good properties.
ORDER FROM EBAY Get a free quote
  • specification
  • Properties
  • ItemDiamond Substrate
    Diameter25.4±0.3mm50.8±0.5mm
    Thickness450±30μm450±30μm
    Growth MethodMPCVD
    Front Surface FinishPolished,Ra<1.0 nm
    Back Surface FinishPolished; Grinding
    Thermal expansivity1.3 (10-6K-1)
    Thermal coefficient1000-2000W/m.K
    TTV≤5 mm≤10 mm
    Edge Exclusion≤3 mm


    Customization specifications:

    * Various sizes and shapes such as 5*5mm,10*10mm,1~4inch.

    * Various thicknesses:0.1~5mm

    * Various surface roughness such as slicing,lapping.

    * crystal type:single crystal diamond or polycrystalline diamond.


  • Diamond is the hardest substance in the world and it is gaining more attention for its outstanding optical, electrical, mechanical, and thermal properties. Artificial diamond can be grown by MPCVD.In this process diamond is grown by starting with a carbon containing gas like methane and hydrogen, then carbon atoms are created by high pressure and high temperature,which is responsible for the deposition on the substrates to form diamond single crystal.


    Crystal StructureCubic
    Lattice Constant(nm)0.3567Å
    Density(g/cm3)3.52
    Melting point(℃)3550
    Mohs Hardness(mohs)10
    Dielectric Constant5.68
    Band Gap(eV)5.47
    Breakdown Electrical Field (MV/cm)10
    Thermal Conductivity(W/cm.K)12-18
    Thermal Expansion 3.196*10-6/k
    Refractive Index 2.417


Recommended Products

2022 © SiC Wafers and GaN Wafers Manufacturer     Powered By Bontop