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2 inch GaAs Wafer

Specific Information
Gallium arsenide(GaAs) can be used for various transistor types like High-electron-mobility transistor (HEMT) and Heterojunction bipolar transistor (HBT), also can be used in other fields like mobile phones,satellite communications,microwave point-to-point links and higher frequency radar systems,infrared light-emitting diodes,laser diodes,and optical windows.GaAs is often used as a substrate material for the epitaxial growth of other semiconductors, including indium gallium arsenide,aluminum gallium arsenide and others.
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  • specification
  • Properties
  • ItemGallium Arsenide Substrate(2~6inch )
    Diameter50.8±0.3mm76.2±0.3mm100.0±0.3mm150.0±0.5mm
    Thickness350±25μm350±25μm350±25μm675±25μm
    Surface Orientation(100) 15.0˚± 1.0˚ off toward (111)<100>±1.0°
    Primary Flat OrientationEJ<0-1-1>±1.0°
    Primary Flat Length12.0±1.5mm22.0±2.0mm32.0±2.0mmNotch
    Secondary Flat OrientationEJ<0-1 1>±1.0°N/A
    Secondary Flat Length7.0±1.5mm12.0±2.0mm18.0±2.0mmN/A
    Front Surface FinishEpi-polished
    Back Surface FinishSSP:Etched; DSP:Epi-polished
    Laser MarkBack side
    TTV≤10μm≤10μm≤15μm≤20μm
    BOW≤12μm≤15μm≤20μm≤25μm
    WARP≤15μm≤20μm≤25μm≤30μm
    Edge Exclusion≤3mm
    ApplicationConductivity for LEDConductivity for LDSemi-insulating for microelectronics
    Conduction TypeN-TypeN-TypeInsulating
    DopantSi-dopingSi-dopingUndoped
    Resistivity(1~9)E-3Ω·cm(1~9)E-3Ω·cm>1E7Ω·cm
    Etch Pit Density(EPD)<5000/cm2<500/cm2<5000/cm2
    Carrier Concentration(0.4~4)E18/cm3(0.4~2.5)E18/cm3N/A
    Mobility>1000cm2/v.s1500~3000cm2/v.s>4000cm2/v.s


    Customization specifications:

    * Various sizes and shapes such as 10*10mm.

    * Various types:like P-Type(Zn-doped)

    * Various orientations such as(111),(110),Off-Axis:2°/6°/10°.

    * Various surface roughness such as slicing,lapping.

    * GaAs crystal ingots are available.


  • Gallium arsenide(GaAs) is an inorganic compound,which is a zinc blende crystal structure, and a black-gray solid with a melting point of1238°C. It is stably below 600°C and is not corroded by non-oxidizing acids. Compared with single crystal silicon(Si), it belongs to the second generation of semiconductor materials and also is a III-V direct band gap semiconductor.


    Gallium arsenide(GaAs) has a direct band gap, higher electron mobility, high-frequency low-noise, and high conversion efficiency and other advantages in comparison to silicon(Si).


    Crystal StructureCubic
    Lattice Constant(nm)a=5.6534 Å  
    Density(g/cm3)5.316
    Melting point(℃)1238
    Mohs Hardness(mohs)5.6
    Dielectric Constant13.1
    Band Gap(eV)1.424
    Breakdown Electrical Field (MV/cm)3.3

    Thermal Conductivity(W/cm.K)

    0.55
    Thermal Expansion 5.8*10-6/k
    Refractive Index 3.24-3.33


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