SiC Substrates for Advanced Packaging: Enabling High-Frequency and High-Temperature Systems
published on 2025-04-24
Silicon carbide (SiC) substrates for advanced packaging are rapidly becoming an important enabling technology for high-frequency and high-temperature systems. Here are some of the reasons why: High-temperature operation: SiC substrates possess high thermal conductivity, thermal stability, and oxidation resistance, maki
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